It is reported that Samsung will start mass production of HBM chips in the second half of this year

Another storage giant is accelerating its HBM layout to meet the growing demand for AI servers, once again driving the growth of the HBM market after Hanmi Semiconductor. It is reported that Samsung Electronics will begin mass production of High Bandwidth Memory (HBM) chips in the second half of this year to meet the continuously growing artificial intelligence (AI) market.

2023-06-28

Japanese EUV photoresist giant JSR agrees to be acquired by the state

It was previously reported that JSR, the Japanese semiconductor equipment manufacturer, said that it was considering an acquisition proposal proposed by the INCJ (JIC), a government private fund. Just yesterday, the management of JSR had accepted the agency's acquisition invitation of about 1 trillion yen, which meant that JSR became a state-owned enterprise again after many years of restructuring and privatization.

2023-06-28

South Korea set up a 300 billion won fund to help the chip industry, and Samsung and SK Hynix promised to inject capital

According to reports, South Korea is actively promoting the development of the chip industry and plans to establish a new fund with an investment scale of 300 billion Korean won to promote the development of related enterprises.

2023-06-27

Intel plans to mass produce 1.8nm technology in 2024

Recently, Intel has frequently launched significant actions. Firstly, within just three days, it announced investment plans totaling over $60 billion. Subsequently, the company announced its most significant transformation plan since its establishment, splitting its internal wafer manufacturing business into independent operations and opening up foundry services. Among them, the 18A process node is the key to this plan.

2023-06-26

Working Principle and Common Fault Handling of Thermal Resistors

A thermistor is an electronic component whose resistance varies with temperature, commonly used in fields such as temperature measurement, electronic temperature control, electronic temperature compensation, and automatic temperature control. The working principle of thermal resistors mainly involves the selection of materials, measurement of resistance values, and application of temperature sensitive characteristics. The following will provide a detailed introduction to the working principle and common fault handling of thermal resistors.

2023-06-24

Nexperia Expands the Packaging Series of NextPower80/100 V MOSFET Product Portfolio

Nexperia, a high-capacity production expert in the field of basic semiconductor devices, today announced the expansion of the NextPower 80/100 V MOSFET product portfolio's packaging series. Previously, this product combination only provided LFPAK56E packaging, but now it has added LFPAK56 and LFPAK88 packaging designs. These devices have high efficiency and low peak characteristics, suitable for communication, server, industrial, switching power supply, fast charging, USB-PD, and motor control applications.

2023-06-23

Cisco launches AI network chips and competes head-on with Botong Marvell

Cisco has launched a network chip for AI supercomputers, which will compete head-on with products from Broadcom and Marvell.

2023-06-21

TSMC leads the AI chip foundry industry and is expected to continue to maintain a leading position

Under the wave of research, development and application of artificial intelligence Chatbot and large language model promoted by ChatGPT, some chip manufacturers have gained new development opportunities, especially Nvidia, a high-performance GPU supplier.

2023-06-21

Infineon Announces ModusToolbox Launch ™ three point one

With software becoming a key feature of various embedded solutions in today's products, embedded developers must acquire and use appropriate software tools to bring these products to the market, such as being able to provide flexible development tools and supporting the best platform from the entry-level to the final hardware deployment in terms of features and functions. Infineon Technologies Technology Co., Ltd. recently announced the launch of a more powerful Modus Toolbox ™ 3.1. Help developers easily utilize more features and develop software solutions for hardware design.

2023-06-20

Meiguang will invest 4.3 billion yuan to expand Xi'an Sealing and Testing Plant

Micron Technology announced today that it plans to invest more than 4.3 billion yuan in its packaging and testing plant in Xi'an, China, in the next few years.

2023-06-19

Investing 22.6 billion yuan, TI plans to build two new factories in Malaysia

Texas Instruments announced its expansion plan in Malaysia, opening two new assembly and testing plants in Kuala Lumpur and Malacca, with a potential investment of 14.6 billion ringgit (about 22.63 billion yuan). It is expected to meet approximately 90% of TI's assembly and testing needs by 2030 to better ensure the stability of its product supply.

2023-06-17

Intel Releases New Silicon Spin Quantum Bit Chip Tunnel Falls

Intel has announced the release of a new quantum chip, Tunnel Falls, containing 12 silicon spin qubits, to continue exploring quantum practicality and solving major challenges. Tunnel Falls is the most advanced silicon spin quantum bit chip developed by Intel to date, leveraging Intel's decades of accumulated transistor design and manufacturing capabilities.

2023-06-17

Application scenarios and precautions for converters

DC-DC converter is a common power converter device mainly used to convert one DC voltage to another voltage level. Due to its high power and efficiency, small size, and light weight, DC-DC converters are widely used in fields such as computer, communication, industrial automation, automotive, aerospace, etc.

2023-06-16

3 billion US dollars! Samsung SDI and General Motors jointly build a battery factory

According to foreign media reports, Samsung SDI has confirmed that it and General Motors will establish a new joint venture battery factory in New City of Carlisle, Indiana.

2023-06-15

News says the European Union will approve Bolton's $61 billion acquisition of VMware.

According to reports, multiple insiders said today that the US chip manufacturer Broadcom's acquisition of cloud computing company VMware is about to receive conditional approval from the European Union.

2023-06-14

In 2023, the revenue of the top ten Foundry model enterprises in Q1 will decrease by nearly 20% month on month

According to the research report released by TrendForce, due to the continued weakness of terminal demand and the addition of the off-season effect, the revenue of the world's top ten wafer OEMs fell 18.6% in the first quarter to about $27.3 billion (Note from IT Home: currently about RMB 194.649 billion). Among them, TSMC led the market with a market share of 60.1%. The biggest change in this ranking was Grosvenor, which surpassed Unicom to win the third place, and Tower Semiconductor, which surpassed Powerchip and Vanguard International Semiconductor Corporation to reach the seventh place.

2023-06-13

Infineon Launches Simple and Easy to Use LCC Design Tool

In the global electricity consumption, lighting electricity accounts for a large proportion, so energy conservation in the lighting field is crucial. It has been proven that the PFC+LCC resonant topology is an excellent solution for LED lighting applications such as commercial lighting, outdoor lighting, and plant lighting:

2023-06-12

In the first five months, the import value of integrated circuits decreased by 24.2%, while the export value decreased by 17.2%

Recently, China Customs released the National Key Import and Export Commodity Value Table for May 2023 (in US dollars).

2023-06-10

How to connect the rectifier circuit? Common wiring methods

In circuits, rectifiers are commonly used to convert alternating current in the power grid into direct current, and are widely used in various electrical and electronic devices. The wiring method of rectifiers has an important impact on their performance and efficiency. If you want to gain a deeper understanding of rectifiers, this article will summarize relevant knowledge and provide a comprehensive understanding and understanding.

2023-06-09

SK Hynix 5th generation 10 nanometer level DDR5 DRAM development completed

SK Hynix announced that its fifth generation 10 nanometer process, 1bnm, has been validated and will provide support for the next generation DDR5 and HBM3E solutions. The SK Hynix 1bnm process will provide a speed of 6.4 Gbps for DDR5 and 8 Gbps for HBM3E.

2023-06-08