Grid chip received $35 million in funding subsidy to accelerate mass production of silicon based gallium nitride wafers

Recently, Gexin announced that it has received $35 million from the US Department of Defense to support its silicon based gallium nitride (GaN on Si) platform at its Vermont factory, which is expected to accelerate the company's mass production of 200mm silicon based gallium nitride wafers.

2023-10-23

Xisu and Armor negotiate and merge to create the world's largest NAND manufacturer

Western Data is currently negotiating the merger of NAND flash memory production business, and they will create the world's largest NAND flash memory manufacturer. The plan involves divesting the flash memory business unit of Western Data, which is about to be finalized, but details are still under consideration. If everything goes according to expectations, the merger will receive significant financial support from major Japanese banks.

2023-10-17

The General Administration of Customs announced that the import and export of integrated circuits continued to increase month on month in August and September

Recently, spokesperson for the General Administration of Customs, Lv Daliang, stated that the industrial advantages have been consolidated, and advantageous export industries such as ships, construction machinery, and home appliances have further improved their market share, international competitiveness, and brand influence. At the same time, the import and export of the consumer electronics industry showed a trend of recovery, with integrated circuit imports and exports rebounding continuously month on month in August and September, while the year-on-year decline in mobile phone and computer exports in September significantly narrowed.

2023-10-16

Samsung plans to launch a new generation of memory HBM4 in 2025

Samsung Electronics has said that it plans to start providing HBM3E samples, is developing HBM4, and aims to supply in 2025. According to Korean media, Sangjun Hwang, vice president of Samsung Electronics and DRAM development director of the memory business department, said recently that he planned to start providing HBM3E samples, and was developing HBM4, with the goal of supplying by 2025.

2023-10-13

Differences between thermal relays and thermal overload relays

Thermal relays and thermal overload relays are common electrical protection devices, but their working principles and protection objects are different. In this article, we will provide a detailed introduction to the differences between thermal relays and thermal overload relays.

2023-10-11

ASML enters Hokkaido to provide technical support for Rapidus

According to media reports, Dutch semiconductor manufacturing equipment giant ASML stated on September 26 that it is exploring the establishment of a base in Chisui City, Hokkaido, Japan in mid-2024 to support the production work of Japanese chip company Rapidus semiconductor factory. ASML plans to arrange technical personnel to provide customer support to Rapidus.

2023-10-10

Nexperia dual channel 500 mA RET enables high-power load switching

Nexperia, a manufacturer in the field of basic semiconductor devices, recently announced the launch of a new 500 mA dual channel built-in resistance transistor (RET) series of products, all in ultra compact DFN 2020 (D) -6 packaging. The new series of devices are suitable for load switches in wearable devices and smartphones, as well as for digital circuits with higher power requirements. For example, space limited computing, communication, industrial, and automotive applications. It is worth noting that the RET packaged with DFN adopts a dual space saving scheme, which can double the space utilization efficiency. Firstly, by cleverly integrating bipolar transistors (BJTs) and resistors into a single package, a significant amount of circuit board space can be saved. In addition, the leadless DFN packaging itself has higher spatial efficiency. This strategy of effective integration and packaging fully highlights Nexperia's unremitting efforts to meet the compact space requirements of contemporary electronic devices.

2023-10-09

According to the news, TSMC has obtained an order for Qualcomm 5G chips using a 3nm process

According to market rumors, mobile chip giant Qualcomm will become the third customer to produce its next generation 5G flagship chip using TSMC's 3nm process after Apple and MediaTek. The news is expected to be announced in late October.

2023-10-07

Types and Packaging of Tantalum Capacitors

Tantalum capacitors are electronic components that use tantalum metal as the electrode material. They are usually divided into two types: polarized and unpolarized, and come in various packaging forms. In this article, we will discuss in detail the types and packaging of tantalum capacitors.

2023-10-06

The difference between thermal relays and fuses

Thermal relays and fuses are common electrical components that play a protective role in circuits. Although they can both interrupt the circuit, there are some differences between them. In this article, we will provide a detailed introduction to the differences between thermal relays and fuses.

2023-10-05

Japan's chip manufacturing equipment sales in August recorded the largest decline in four years

The latest data shows that in August 2023, the 3-month moving average released by the Japan Semiconductor Manufacturing Equipment Association (SEAJ) showed that Japan's semiconductor equipment sales were 286.504 billion yen, a year-on-year decrease of 17.5%, marking the third consecutive month of contraction. In addition, sales for the third consecutive month fell below the 300 billion yen mark, marking the largest decline since July 2019 (a year-on-year decrease of 18.8%).

2023-10-04

The United States will extend Samsung and SK Hynix's exemption from selling chips to China

According to reports, the United States is expected to indefinitely extend the exemption for South Korean chip manufacturers Samsung and SK Hynix to import US chip equipment at their factories in China. Multiple sources have stated that the United States will release relevant announcements as early as this week.

2023-10-03

FT2232 Development Board

A development board designed with FT2232 chip, which fully leads out the IO port, can be used to design an interface expansion board based on this.

2023-09-20

Renesa Electronics collaborates with Meibei Sanmei to develop an angle sensor stepper motor control scheme

Ruisa Electronics Co., Ltd., a leading global semiconductor solution supplier, and Meibei Sanmei Co., Ltd., a leading global stepper motor supplier, have announced the joint development of stepper motor and motor control solutions based on rotary transformers (angle sensors), and have been optimized for machinery, office automation (OA) equipment, and medical/nursing equipment. The stepper motor and motor control solution based on rotary transformer sensors jointly developed by Ruisa Electronics and Meibei Sanmei can meet the needs of higher precision control, miniaturization, and stronger resistance to environmental impacts of motors.

2023-09-13

It is reported that TSMC has collaborated with Broadcom, Nvidia, and others to develop silicon photonic technology

According to the news, TSMC has collaborated with major clients such as Broadcom and Nvidia to develop new products such as silicon photonic technology and co packaging optical components. The process technology has been extended from 45nm to 7nm, with large orders starting from the second half of next year at the earliest. It is expected to enter the stage of large-scale production by 2025.

2023-09-12

Intel Announces a New OEM Agreement with Gaota Semiconductor

Recently, Intel Foundry Services (IFS) announced a new OEM agreement with Tower Semiconductor, an Israeli semiconductor foundry.

2023-09-11

AI high-performance computing - integrated storage and computing

Integrated storage and computing or in memory computing is the complete integration of storage and computing, directly utilizing memory for data processing or computation. Under the traditional von Neumann architecture, data storage and computation are separated. Due to the increasing performance gap between storage and computation, the speed at which the processor accesses stored data is much lower than the processor's computation speed. The energy consumption of data transportation between memory and main memory is also much higher than the energy consumed by the processor's computation.

2023-08-22

AI High Performance Computing - Google TPU

Since Google launched the first generation self-developed artificial intelligence chip Tensor Processing Unit (TPU) in 2016, it has been upgraded to the fourth generation TPU v4 after several years of development (as of the end of 2022). The TPU architecture design also achieves efficient computation of network layers such as deep learning convolutional layer and fully connected layer by efficiently parallelizing a large number of multiplication and accumulation operations.

2023-08-22